JPH0195730U - - Google Patents

Info

Publication number
JPH0195730U
JPH0195730U JP19223387U JP19223387U JPH0195730U JP H0195730 U JPH0195730 U JP H0195730U JP 19223387 U JP19223387 U JP 19223387U JP 19223387 U JP19223387 U JP 19223387U JP H0195730 U JPH0195730 U JP H0195730U
Authority
JP
Japan
Prior art keywords
screw shaft
feed screw
plasma processing
processing machine
reaction chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19223387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19223387U priority Critical patent/JPH0195730U/ja
Publication of JPH0195730U publication Critical patent/JPH0195730U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP19223387U 1987-12-18 1987-12-18 Pending JPH0195730U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19223387U JPH0195730U (en]) 1987-12-18 1987-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19223387U JPH0195730U (en]) 1987-12-18 1987-12-18

Publications (1)

Publication Number Publication Date
JPH0195730U true JPH0195730U (en]) 1989-06-26

Family

ID=31483100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19223387U Pending JPH0195730U (en]) 1987-12-18 1987-12-18

Country Status (1)

Country Link
JP (1) JPH0195730U (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372649A (ja) * 1989-08-11 1991-03-27 Tokyo Electron Sagami Ltd 処理装置
JPH09115846A (ja) * 1995-10-16 1997-05-02 Nippon Pillar Packing Co Ltd 半導体ウエハーの加熱処理装置
JP2014179647A (ja) * 2014-05-26 2014-09-25 Koyo Thermo System Kk 基板の熱処理装置
WO2016052023A1 (ja) * 2014-09-30 2016-04-07 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および記録媒体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5860552A (ja) * 1981-10-05 1983-04-11 Tokyo Denshi Kagaku Kabushiki 縦型自動プラズマ処理装置
JPS58196357A (ja) * 1982-05-12 1983-11-15 Mikuni Kogyo Co Ltd 駆動機構

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5860552A (ja) * 1981-10-05 1983-04-11 Tokyo Denshi Kagaku Kabushiki 縦型自動プラズマ処理装置
JPS58196357A (ja) * 1982-05-12 1983-11-15 Mikuni Kogyo Co Ltd 駆動機構

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0372649A (ja) * 1989-08-11 1991-03-27 Tokyo Electron Sagami Ltd 処理装置
JPH09115846A (ja) * 1995-10-16 1997-05-02 Nippon Pillar Packing Co Ltd 半導体ウエハーの加熱処理装置
JP2014179647A (ja) * 2014-05-26 2014-09-25 Koyo Thermo System Kk 基板の熱処理装置
WO2016052023A1 (ja) * 2014-09-30 2016-04-07 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および記録媒体
JPWO2016052023A1 (ja) * 2014-09-30 2017-08-17 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および記録媒体
US10837112B2 (en) 2014-09-30 2020-11-17 Kokusai Electric Corporation Substrate processing apparatus

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